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Durability of isocyanate resin adhesives for wood I: Thermal properties of isocyanate resin cured with water


The thermal properties of isocyanate (IC) resin cured with water were studied using dynamic mechanical analysis (DMA) and Fourier transform infrared spectroscopy. The thermal properties of cured phenol formaldehyde (PF) resin were also studied for comparison purposes. The DMA specimens were prepared using a unique technique. The relation between the mechanical and chemical changes of the resin during DMA was clarified. The cured PF resin had better thermal stability than the IC resin cured with water. The improvement of thermal stability in cured IC resin by heat treatment was considered to be less effective. The effect of the heating rate on the mechanical properties was also investigated. The apparent activation energy in the thermal degradation of cured IC resin was calculated based on the results obtained.


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Correspondence to Kenji Umemura.

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Umemura, K., Takahashi, A. & Kawai, S. Durability of isocyanate resin adhesives for wood I: Thermal properties of isocyanate resin cured with water. J Wood Sci 44, 204–210 (1998).

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Key words

  • Isocyanate resin adhesives
  • Thermal properties
  • Dynamic mechanical analysis
  • Fourier transform infrared spectroscopy
  • Wood adhesives