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Journal of Wood Science

Official Journal of the Japan Wood Research Society

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Behavior of acoustic emission generation during tensile tests perpendicular to the plane of particleboard II: effects of particle sizes and moisture content of boards

Journal of Wood Science volume 48, pages 374–379 (2002)Cite this article

Abstract

Particleboard specimens with various particle sizes were conditioned into two ranges: low and high moisture content. One set was investigated for internal bond (IB) strength and acoustic emission (AE) events during tensile tests perpendicular to the plane and the other for ultrasonic wave transmission characteristics in the thickness direction. The particleboard structural mechanics were changed as a result of the moisture effect. Specimens conditioning to higher moisture content had lower IB strength and lower cumulative acoustic emission event counts (T AE). The decrease in IB strength indicated that the irreversible thickness swelling was seen when recovery forces of the particles exceed the restraining action of the adhesive. This was attributed to stress release, which resulted in internal failure of the board. The change in the internal structure caused an increased stress level at the initiation of AE generation. No events were recorded before this stress level, obeying theKaiser effect. The decrease inT AE was not only related to the decrease in IB strength but was also affected by the transformation (attenuation) of the AE signals during IB tests according to the mesh size used.

References

  1. Miller RK, McIntire P (1978) Nondestructive testing handbook. In:Acoustic emission testing. 2nd ed. vol 5. American Society for Nondestructive Testing, Columbus, Ohio, pp 11–22, 34–38, 45–62

    Google Scholar 

  2. Fujimoto Y, Lin HC, Mataki Y (1997) Behavior of acoustic emission generation during tensile test perpendicular to the plane of particleboard — particularly, effect of internal structure factor of board (in Japanese). J Soc Mater Sci 46:413–418

    Article  CAS  Google Scholar 

  3. Beall FC (1985) Relationship of acoustic emission to internal bond strength of wood-based composite panel materials. J Acoust Emiss 4(1):19–29

    CAS  Google Scholar 

  4. Beall FC (1985) Effect of resin content and density on acoustic emission from particleboard during internal bond testing. For Prod J 36(7/8):29–33

    Google Scholar 

  5. Japanese Standards Association (1994) JIS standard for particleboard JIS A 5908

  6. Lin H-C, Matsumoto H, Fujimoto Y, Murase Y (2001) Development of an acousto-ultrasonic measuring method for particleboard thickness direction. J Fac Agric Kyushu Univ 45:541–556

    Google Scholar 

  7. Kruse K, Broker FW, Fruhwald A (1996) Interrelation between internal bond, density distribution and ultrasonic velocity of particleboard (in German). Holz Roh Werkstoff 54:295–299

    Article  CAS  Google Scholar 

  8. Saito F, Hashimoto F, Hayakawa T (1978) Mechanical properties of particleboard. III. The effect of moisture content on mechanical properties of particleboard (in Japanese). Mokuzai Gakkaishi 24:714–719

    Google Scholar 

  9. Suzuki S, Saito F (1986) Fatigue behavior of particleboard in tension perpendicular to the surface. II. Effect of moisture content (in Japanese). Mokuzai Gakkaishi 32:801–807

    Google Scholar 

  10. Halligan AF, Schniewind AP (1974) Prediction of particleboard mechanical properties at various moisture contents. Wood Sci Technol 8:68–78

    Google Scholar 

  11. Beall FC (1986) Effect of moisture conditioning on acoustic emission from particleboard. J Acoust Emiss 5(2):71–76

    Google Scholar 

  12. Armstrong JP, Patterson DW, Sneckenberger JE, Mallory JC, Pellerin RF (1991) Evaluation of a stress wave NDT technique for detecting skips in the gluelines of edge-glued red oak panels. For Prod J 41(11/12):61–66

    Google Scholar 

  13. Lin H-C, Fujimoto Y, Murase Y (2000) Characteristic of ultrasonic wave transmission in particleboard. In: Proceedings of the 5th Pacific Rim Bio-Based Composites Symposium, Canberra, Australia, pp 478–484

  14. Sun Y-G, Arima T (1998) Structural mechanics of wood composite materials. I. Ultrasonic evaluation of internal bond strength during an accelerated aging test. J Wood Sci 44:348–353

    Article  Google Scholar 

  15. Ross RJ, Pellerin RF (1988) NDE of wood-based composites with longitudinal stress waves. For Prod J 38(5):39–45

    Google Scholar 

  16. Sun Y-G, Arima T (1999) Structural mechanics of wood composite materials. II. Ultrasonic propagation mechanism of internal bonding of particleboard. J Wood Sci 45:221–226

    Article  Google Scholar 

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Authors and Affiliations

  1. Wood Material Technology, Laboratory of Biomaterial Science, Graduate School of Bioresource and Bioenvironmental Sciences, Kyushu University, 812-8581, Fukuoka, Japan

    Han Chien Lin

  2. Wood Engineering Division, Miyazaki Prefectural Wood Utilization Research Center, 885-0037, Miyazaki, Japan

    Yoshiyasu Fujimoto

  3. Wood Material Technology, Laboratory of Biomaterial Science, Faculty of Agriculture, Kyushu University Graduate School, 812-8581, Fukuoka, Japan

    Yasuhide Murase

  4. Laboratory of Wood Technology, Department of Forest and Forest Products Sciences, Faculty of Agriculture, Kyushu University, 812-8581, Fukuoka, Japan

    Yoshihiro Mataki

Authors
  1. Han Chien Lin
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  2. Yoshiyasu Fujimoto
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  3. Yasuhide Murase
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  4. Yoshihiro Mataki
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Correspondence to Han Chien Lin.

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Lin, H.C., Fujimoto, Y., Murase, Y. et al. Behavior of acoustic emission generation during tensile tests perpendicular to the plane of particleboard II: effects of particle sizes and moisture content of boards. J Wood Sci 48, 374–379 (2002). https://doi.org/10.1007/BF00770696

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  • DOI: https://doi.org/10.1007/BF00770696

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