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Official Journal of the Japan Wood Research Society

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Thermal properties of interior decorative material and contacted sensory cold-warmth I: relation between skin temperature and contacted sensory cold-warmth


The purpose of the study was to investigate the relation between the skin temperature of the palm and sensory cold-warmth after contact with some materials. Ten men and ten women were selected and introduced to 21 kinds of material for a contact test of 30 min without seeing the specimens in a climate-controlled room at 25‡±1‡C and 65% relative heemidity. The palm-contacted test materials and skin temperature of the palm, central fingertip, and back of the palm were measured during the experiment. A sensory evaluation test was applied to evaluate the contacted sensory cold-warmth. Results showed that the maximum temperature decrease of the fingertip (Td) was positively related to the natural logarithm of the material's specific gravity (lnρu) and to the natural logarithm of the material's thermal conductivity (lnλ). There were also negative linear relations between the contacted sensory cold-warmth (S) with lnρu and lnλ; and there was a negative linear relation betweenS withTd and betweenS with the value ofTd by λ. The thermal osmotic coefficient (b) of wood and wood-based materials ranged from 3.63 to 3.97, and the materials were qualified as good thermal insulation materials. Furthermore, there was a negative linear relation betweenS andb. Accordingly, it is possible to evaluate the contacted sensory cold-warmth relying on the basic thermal properties of material.


  1. Sadoh T, Nomata T (1993) Computer simulation of thermal behavior at human skin-woody material interfaces. J Soc Mater Sci Jpn 42:157–161

    Article  Google Scholar 

  2. Sadoh T (1986) Tactility behavior of wood. In: Yamada M (ed) Living properties of wood. Wooden Environmental Science, pp 53–59

  3. Suzuki M (1989) Sensory behavior of tactility of wood. In: Wood science and utilization technology, no. 3: living behavior. Reports of Research Division of Japan Wood Research Society, pp 282–288

  4. Okajima T (1984) Tactile response of building materials. Wood Ind 39(8):9–12

    Google Scholar 

  5. Sakuragawa S, Maruyama N, Hirai N (1991) Evaluation of contacted thermal comfort of floor by heat-flow. Mokuzai Gakkishi 37:753–757

    Google Scholar 

  6. Okuma M, Izumi K (1979) Tactile warmth of the finishing materials of houses on furnitures. Wood Ind 34(8):8–13

    Google Scholar 

  7. Wang SY, Kuo PW (1993) Thermal conductivity of three softwood species grown in Taiwan (in Chinese). Q J Exp Natl Taiwan Univ 7(4):77–94

    Google Scholar 

  8. Wang SY, Kuo PW (1995) Changes of skin temperature of feet contacted floors constructed of different materials. Mokuzai Gakkishi 41:731–740

    Google Scholar 

  9. Liao CC, Weng LH, Lin MY, Wang SY (1997) Thermal conductivity of interior decoration materials (in Chinese). For Prod Ind 16:625–636

    Google Scholar 

  10. Kawamura Y, Yashiro M, Takano R (1970) Physical faculties experiment of flooring materials. Bull Niigata Univ Agric For 22:73–79

    Google Scholar 

  11. Harada Y, Nakato K, Sadoh T (1983) Thermal properties and sensory warmth of wood surfaces. Mokuzai Gakkishi 29:205–212

    Google Scholar 

  12. Takahashi A, Suzaki M, Nakao T (1995) Wood Science Divisions 5, Environment, Kaisei publisher, pp 108–109

  13. Okajima T, Tanahashi I, Yasuda T, Takeda Y (1976) Tactile warmth of building materials. Japan Building Society Bulletin 245:1–7

    Google Scholar 

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Correspondence to Song-Yung Wang.

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Wang, SY., Lin, FC. & Lin, MY. Thermal properties of interior decorative material and contacted sensory cold-warmth I: relation between skin temperature and contacted sensory cold-warmth. J Wood Sci 46, 357–363 (2000).

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