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Manufacture and properties of ultra-low-density fiberboard

Abstract

Low-density fiberboards with densities ranging from 0.05 to 0.50g/cm3 were manufactured with steam injection pressing. Bond-type and foam-type isocyanate compound resin adhesives were used separately at 10% and 30% resin content levels. Two types of different-size fibers from softwood were used. Mechanical, dimensional, thermal, and sound insulation properties of the fiberboards were tested. The results are as follows: (1) Bond-type isocyanate adhesive showed higher mechanical and dimensional properties of low-density fiberboards than the foam-type adhesive. (2) Fiberboards produced from small fibers have better mechanical and dimensional properties than those made from large fibers. (3) Thermal conductivity of fiberboards depends more on the board density than on the type of resin or fiber dimension. At a board density lower than 0.2 g/cm3, the thermal conductivity is almost equivalent to those of thermal insulation materials such as polystyrene foam and rock wool, (4) Generally, the sound absorption coefficient of low-density fiberboards tends to increase at higher sound frequency. As the board thickness increases, low-frequency sounds are more readily absorbed by boards.

References

  1. 1.

    Kawai S, Sasaki H (1986) Production technology for low-density particleboard. I. Mokuzai Gakkaishi 32:324–330

  2. 2.

    Kawai S, Suda H, Nakaji M, Sasaki H (1986) Production technology for low-density particleboard. II. Mokuzai Gakkaishi 32:876–882

  3. 3.

    Suda H, Kawai S, Sasaki H (1987) Production technology for lowdensity particleboard. III. Mokuzai Gakkaishi 33:376–384

  4. 4.

    Kawai S, Suda H, Sasaki H (1987) Production technology for lowdensity particleboard. IV. Mokuzai Gakkaishi 33:385–392

  5. 5.

    Kawai S, Nakaji M, Sasaki H (1987) Production technology for low-density particleboard. V. Mokuzai Gakkaishi 33:702–707

  6. 6.

    Kawai S, Sasaki H, Ishihara S, Takahashi A, Nakaji M (1988) Thermal, sound, and fire resistance performance of low-density particleboard. Mokuzai Gakkaishi 34:973–980

  7. 7.

    Rowell RM, Kawai S, Inoue M (1995) Dimensionally stabilized, very low density fiberboard. Wood Fiber Sci 27:428–436

  8. 8.

    Kawai S (1996) Development ultra-light fiberboard: report of the Grant-in-Aid for Scientific Research (C) (No. 06660214) from the Ministry of Education, Science and Culture of Japan, pp 28–36

  9. 9.

    Sudou S (1994) Sekai no mokuzai no iroiro (in Japanese). In: Uemura T (ed) Mokuzai katsuyo jiten. Sangyo Chosakai Jiten Syuppan Center, Tokyo, p 651

  10. 10.

    Saeki H (1982) Hinoki (in Japanese). In: Sugihara H (ed) Mokuzai kogyo jiten. Kogyo Shuppan, Tokyo, p 516

  11. 11.

    Zhang M, Kawai S, Sasaki H, Yamawaki T, Yoshida Y, Kashihara M (1995) Manufacture and properties of composite fiberboard. Mokuzai Gakkaishi 41:903–910

  12. 12.

    Okudaira Y, Ando H, Satoh M, Miyanami K (1994) Dynamic measurements for the stiffness constant of a powder bed. Powder Technol 81:139–147

  13. 13.

    Okudaira Y, Kurihara Y, Ando H (1993) Sound absorption measurements for evaluating dynamic physical properties of a powder bed. Powder Technol 77:39–48

  14. 14.

    Ilvessalo-Pfäffli M-S (1995) Fiber atlas. Springer, Berlin, pp 15–18

  15. 15.

    Zhang M, Kishimoto Y, Kawai S, Sasaki H (1994) Relationship between tensile strength of natural fibers and their sizes. Wood Res Techn Notes 30:32–39

  16. 16.

    Takahashi H, Endoh H, Ohsawa K, Moriyama M, Endoh K (1974) Effects of characteristics of fiber ground by refiner on physical properties of fiberbord. I. Mokuzai Gakkaishi 20:430–434

  17. 17.

    Watanebe N (1978) Mokuzai rigaku souron (in Japanese). Norm Syuppan, Tokyo, pp 323–324

  18. 18.

    Maku T, Sasaki H, Ishihara S, Kimoto K, Kamo H (1968) On some properties of composite panels. Mokuzai Kenkyu 44:21–52

  19. 19.

    Kishitani K (1981) Saishin kenchiku naigaiso handbook (in Japanese). Kenchiku Sangyo Chosakai, Tokyo, p 557

  20. 20.

    Shida S, Okuma M (1981) The effect of the apparent specific gravity on thermal conductivity of particleboard. Mokuzai Gakkaishi 27:775–781

  21. 21.

    Shida S, Okuma M (1980) Dependency of thermal conductivity of wood based materials on temperature and moisture content. Mokuzai Gakkaishi 26:112–117

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Correspondence to Tamami Kawasaki.

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Kawasaki, T., Zhang, M. & Kawai, S. Manufacture and properties of ultra-low-density fiberboard. J Wood Sci 44, 354–360 (1998). https://doi.org/10.1007/BF01130447

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Key words

  • Low-density fiberboard
  • Isocyanate resin Physical property
  • Thermal insulation
  • Sound insulation