Skip to main content

Official Journal of the Japan Wood Research Society

  • Original Article
  • Published:

Structural mechanics of wood composite materials 11: Ultrasonic propagation mechanism and internal bonding of particleboard

Abstract

Ultrasonic nondestructive evaluation (NDE) methods have been successfully applied for grading lumber and veneer at the in-plant level. To expand this application in wood composite production, further research is needed to elucidate the effect of differences of component elements within wood composite panels on the behavior of ultrasonic waves traveling through them. The objective of this study was to investigate the effects of the internal bonding of particleboard specimens containing component chips of different geometry on ultrasonic velocity. Commercial chips screened at four sizes were used to produce particleboard specimens with different internal bonding by controlling their out-of-press thickness at (a) a constant thickness for boards made of each chip size, and (b) four different thicknesses for boards made of the same chip size. Twenty-four boards were made with phenol-formaldehyde (PF) resin at 8% solid resin content in our laboratory. After the velocities of the waves traveling through the thickness of the boards were recorded, the internal bond strengths were tested. Results showed the density, internal bond state, and constituted chip geometry were the main factors influencing the velocity. NDE using ultrasonic waves is an available method to evaluate the internal bonding of particleboard with a density less than about 0.75g/cm3. With densities over that value, no significant changes of the velocity were found.

References

  1. Kaiserlik JH, Pellerin RF (1976) Stress wave attenuation as an indicator of lumber strength. For Prod J 27(6):39–43

    Google Scholar 

  2. Gerhards CG (1982) Longitudinal stress waves for lumber stress grading: factors affecting applications: state of art. For Prod J 32(2):20–25

    Google Scholar 

  3. Bender DA, Burk AG, Taylor SE, Hooper JA (1990) Predicting localized MOE and tensile strength in solid and finger-jointed laminating lumber using longitudinal stress waves. For Prod J 40(3):45–47

    Google Scholar 

  4. Ross RJ, Pellerin RF (1991) Nondestructive testing for assessing wood members in structures: a review. General Technical Report FPL-70. USDA Forest Service, Forest Product Laboratory, Madison, WI

    Google Scholar 

  5. Pu JH, Tang RC (1997) Nondestructive evaluation of modulus of elasticity of southern pine LVL: effect of veneer grade and relative humidity. Wood Fiber Sci 29:249–363

    CAS  Google Scholar 

  6. Ross RJ, Pellerin RF (1988) NDE of wood-based composites with longitudinal stress waves. For Prod J 38(5):39–45

    CAS  Google Scholar 

  7. Japanese Standards Association (1994) JIS standard for particleboard JIS A 5908, Japan. Japanese Standards Association

    Google Scholar 

  8. Sasaki Y, Iwata T, Ando K (1998) Acoustoelastic effect of wood. II. Effect of compressive stress on the velocity of ultrasonic longitudinal waves parallel to the transverses of the wood. J Wood Sci 44:21–27

    Article  Google Scholar 

  9. Shuler CE, Kelly RA (1974) Effect of flake geometry on mechanical properties of eastern spruce flake-type particleboard. For Prod J 26(6):24–28

    Google Scholar 

  10. Armstrong JP, Patterson DW, Sneckenberger JE, Mallory JC, Pellerin RF (1991) Evaluation of a stress wave NDT technique for detecting skips in the gluelines of edge-glued red oak panels. For Prod J 41(11/12):61–66

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Yu-Guo Sun.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Sun, YG., Arima, T. Structural mechanics of wood composite materials 11: Ultrasonic propagation mechanism and internal bonding of particleboard. J Wood Sci 45, 221–226 (1999). https://doi.org/10.1007/BF01177729

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF01177729

Key words