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Journal of Wood Science

Official Journal of the Japan Wood Research Society

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Chemical changes of kenaf core binderless boards during hot pressing (I): influence of the pressing temperature condition

Journal of Wood Science volume 52, pages 244–248 (2006)Cite this article

Abstract

Self-bonding is the main factor of the performance expression of binderless boards, and therefore its clarification is considered to be an important issue. For this purpose, a series of chemical analyses were conducted on kenaf core binderless boards and their chemical changes during the hot-pressing process are discussed in this article. First of all, binderless boards were prepared from kenaf core powder at different pressing temperatures (without steam-explosion process) and were used for chemical analyses after they were reduced into powders and extracted with methanol. To investigate their chemical changes, lignin, holocellulose, and neutral sugar contents were determined, Fourier transform infrared (FTIR) spectra were recorded, and the nitrobenzene oxidation procedure was applied. As a result, it was found that parts of lignin and hemicelullose were decomposed during the hot-pressing process; however, the contribution of the resulting fractions to selfbonding was not observed. In addition, progress of condensation reactions in lignin and the formation of chemical bonds by low molecular weight conjugated carbonyl compounds in methanol extractives were observed. Thermal softening of lignin is also suggested to play an important role in the expression of board performance.

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Authors and Affiliations

  1. Department of Global Agricultural Sciences, Graduate School of Agricultural and Life Sciences, The University of Tokyo, 1-1-1 Yayoi, Bunkyo-ku, Tokyo, 113-8657, Japan

    Nobuhisa Okuda, Keko Hori & Masatoshi Sato

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  1. Nobuhisa Okuda
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  2. Keko Hori
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  3. Masatoshi Sato
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Correspondence to Nobuhisa Okuda.

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Okuda, N., Hori, K. & Sato, M. Chemical changes of kenaf core binderless boards during hot pressing (I): influence of the pressing temperature condition. J Wood Sci 52, 244–248 (2006). https://doi.org/10.1007/s10086-005-0761-4

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  • DOI: https://doi.org/10.1007/s10086-005-0761-4

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