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Official Journal of the Japan Wood Research Society

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Water resistance properties of kenaf core binderless boards


Abstract Binderless boards were prepared from kenaf core under various manufacturing conditions and their water resistance properties were evaluated. The board properties evaluated were retention ratios of modulus of rupture (MOR) and modulus of elasticity (MOE), internal bonding strength after water treatment (IB), thickness swelling (TS), water absorption (WA), and linear expansion (LE). These values were then compared with those of boards bonded with urea-formaldehyde (UF), urea melamine formaldehyde (UMF), and phenol-formaldehyde (PF) resins, and their water resistance properties were assessed. We found that pressing temperature was one of the most important conditions for the improvement of water resistance properties. The retention ratios of MOR, MOE, and IB of kenaf core chip binderless boards (pressing temperature 200°C, target density 0.8g/cm3, and the three-step pressing of 6MPa for 10min, then 4MPa for 3min, and 2MPa for 3min) were 37.1%, 49.9%, and 55.7%, respectively, compared with values for UMF-bonded boards of 22.5%, 27.1%, and 40.7%, and values for PF-bonded boards of 42.8%, 41.8%, and 54.1%, respectively. The results showed that the water resistance properties of binderless boards were higher than those of UMF-bonded boards and almost as high as those of PF-bonded boards.


  1. 1.

    Fuwape JA, Oyagade AO (1993) Bending strength and dimensional stability of tropical wood cement particleboard. Bioresource Technol 44:77–79

    CAS  Article  Google Scholar 

  2. 2.

    Mobarak F, Fahmy Y, Augustin H (1982) Binderless lignocellulose composite from bagasse and mechanism of self-bonding. Holzforschung 36:131–135

    CAS  Article  Google Scholar 

  3. 3.

    Xu J, Han G, Wong ED (2003) Development of binderless particleboard from kenaf core using steam-injection pressing. J Wood Sci 49:327–332

    Article  Google Scholar 

  4. 4.

    Angles MN, Ferrando F, Farriol X, Salvado J (2001) Suitability of steam exploded residual softwood for the production of binderless panels. Effect of the pre-treatment severity and lignin addition. Biomass Bioenerg 21:211–224

    CAS  Article  Google Scholar 

  5. 5.

    Velasquez JA, Ferrando F, Salvado J (2002) Binderless fiberboard from steam exploded Miscanthus sinensis: the effect of a grinding process. Holz Roh Werkst 60:297–302

    CAS  Article  Google Scholar 

  6. 6.

    Velasquez JA, Ferrando F, Salvado J (2003) Effects of kraft lignin addition in the production of binderless fiberboard from steam exploded Miscanthus sinensis. Ind Crop Prod 18:17–23

    CAS  Article  Google Scholar 

  7. 7.

    Suzuki S, Shintani H, Park SY, Saito K, Laemsak N, Okuma M, Iiyama K (1998) Preparation of binderless boards from steam exploded pulps of oil palm (Elaeis guneensis Jaxq.) fronds and structural characteristics of lignin and wall polysaccharides in steam exploded pulps to be discussed for self-bonding. Holzforschung 52:417–426

    CAS  Article  Google Scholar 

  8. 8.

    Laemsak N, Okuma M (2000) Development of boards made from oil palm frond II: properties of binderless boards from steam-exploded fibers of oil palm frond. J Wood Sci 46:322–326

    Article  Google Scholar 

  9. 9.

    Angles MN, Reguant J, Montane D, Ferrando F, Farriol X, Salvado J (1999) Binderless composites from pretreated residual softwood. J Appl Polym Sci 73:2485–2491

    CAS  Article  Google Scholar 

  10. 10.

    Takasu Y, Takahashi I (2005) Manufacture of self-bonding molding from woody material (in Japanese). APAST 15:4–7

    Google Scholar 

  11. 11.

    Okuda N, Sato M (2004) Manufacture and mechanical properties of binderless boards from kenaf core. J Wood Sci 50:53–61

    Article  Google Scholar 

  12. 12.

    Van Dam JEG, Van Den Oever MJA, Keijsers ERP (2004) Production process for high density high performance binderless boards from whole coconut husk. Ind Crop Prod 20:97–101

    Article  Google Scholar 

  13. 13.

    Tomimura Y, Matsuda T, Suzuki I, Nagasawa S (1985) Strand boards and waferboards from Japanese coniferous thinnings and used structural timbers (in Japanese). Mokuzai Gakkaishi 31:1047–1052

    Google Scholar 

  14. 14.

    Miyamoto K, Nakahara S, Suzuki S (2002) Effect of particle shape on linear expansion of particleboard. J Wood Sci 48:185–190

    Article  Google Scholar 

  15. 15.

    Miyamoto K, Suzuki S, Inagaki T, Iwata R (2002) Effects of press closing time on mat consolidation behavior during hot pressing and on linear expansion of particleboard. J Wood Sci 48:309–314

    CAS  Article  Google Scholar 

  16. 16.

    Widyorini R, Xu J, Watanabe T, Kawai S (2005) Chemical changes in steam-pressed kenaf core binderless particleboard. J Wood Sci 51:26–32

    CAS  Article  Google Scholar 

  17. 17.

    Okuda N, Hori K, Sato M (2006) Chemical changes of kenaf core binderless boards during hot pressing (I): influence of the pressing temperature condition. J Wood Sci 52:244–248

    CAS  Article  Google Scholar 

  18. 18.

    Okuda N, Hori K, Sato M (2006) Chemical changes of kenaf core binderless boards during hot pressing (II): their effect on the binderless board properties. J Wood Sci 52:249–254

    CAS  Article  Google Scholar 

  19. 19.

    Sekino N, Inoue M, Irle M, Adcock T (1999) The mechanism behind the improved dimensional stability of particleboards made from steam-pretreatment particles. Holzforschung 53:435–440

    CAS  Article  Google Scholar 

  20. 20.

    Kelly MW (1977) Critical literature review of relationships between processing parameters and physical properties of particleboard. General technical report FPL-10, U.S. Department of Agriculture Forest Service Forest Products Laboratory, Madison, WI

    Google Scholar 

  21. 21.

    Hiziroglu S, Suchsland O (1993) Linear expansion and surface stability of particleboard. For Prod J 43:31–34

    CAS  Google Scholar 

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Correspondence to Nobuhisa Okuda.

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Okuda, N., Sato, M. Water resistance properties of kenaf core binderless boards. J Wood Sci 52, 422–428 (2006).

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Key words

  • Self-bonding
  • Binderless board
  • Water resistance property
  • Kenaf core