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Journal of Wood Science

Official Journal of the Japan Wood Research Society

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Fire resistance of thick wood-based boards

Journal of Wood Science volume 52, pages 544–551 (2006)Cite this article

Abstract

Thick wood-based boards are used as construction materials for walls and floors in Japan. In this study, fire resistance tests (ISO 834-1) and cone calorimeter tests (ISO 5660-1) were conducted for thick plywood, particleboard, and medium density fiberboard with sample thicknesses of about 28–30mm, and their suitabilities for quasi-fireproof or fire-preventive structures were evaluated. In the ISO 834-1 fire resistance test, the heat-shielding performance (insulation criterion) for walls was evaluated and the results showed that the larger the apparent density of a woodbased board, the higher its insulation performance. The insulation performance of thick wood-based boards in the fire resistance test could be forecast from the results of the cone calorimeter test, especially when the second peak of heat release rate appeared. In the cone calorimeter tests, the surface layer density of the plywood, particleboard, and medium density fiberboard was the dominant parameter for the time to ignition and initial heat release rate. These results indicate that thick wood-based board is a suitable fire-preventive construction material.

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Authors and Affiliations

  1. Forestry and Forest Products Research Institute, PO Box 16, Tsukuba Norin-Kenkyu Danchi-Nai, Tsukuba, 305-8687, Japan

    Toshiro Harada & Saburou Uesugi

  2. Building Research Institute, Tsukuba, 305-0802, Japan

    Hideaki Masuda

Authors
  1. Toshiro Harada
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  2. Saburou Uesugi
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  3. Hideaki Masuda
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Corresponding author

Correspondence to Toshiro Harada.

Additional information

Part of this study was presented at the Annual Meeting of the Architectural Institute of Japan, Hokkaido, Japan, August 2004

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Harada, T., Uesugi, S. & Masuda, H. Fire resistance of thick wood-based boards. J Wood Sci 52, 544–551 (2006). https://doi.org/10.1007/s10086-006-0805-4

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  • DOI: https://doi.org/10.1007/s10086-006-0805-4

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