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Journal of Wood Science

Official Journal of the Japan Wood Research Society

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Effect of postcure conditions on the dynamic mechanical behavior of water-based polymer-isocyanate adhesive for wood

Journal of Wood Science volume 54, pages 377–382 (2008)Cite this article

Abstract

To study the effect of postcure conditions on the viscoelastic behavior of water-based polymer isocyanate adhesives for wood (API adhesive), dynamic mechanical analysis (DMA) was performed for a simplified model of API adhesives under various postcure conditions. These conditions were achieved by storing the samples at room temperature or by heating them in an oven. Fourier transform infrared (FT-IR) spectroscopy was performed to test for residual isocyanate groups (NCO) and isocyanate derivatives to elucidate the reaction mechanism under the postcure conditions. DMA revealed that the postcure conditions led to wide variations in the viscoelastic behaviors of API films. FT-IR analysis confirmed the decrease of residual isocyanate during postcure treatments. However, the complete consumption of isocyanate could not be achieved under the postcure conditions. A good correlation was found between the DMA result and the chemical changes in the API samples heated above 140°C. However, no correlation was observed in the case of the samples heated at temperatures less than 140°C. This implies that postcure conditions led to a difference in the reaction chemistry of API.

References

  1. Tanaka T, Inoue T, Kuwako N (1996) Water based polymerisocyanate adhesive for wood (in Japanese). Nippon Kagaku Kaishi 1–7

  2. Mototani Y, Nakano T, Hasegawa Y, Hirabayashi Y (1996) Adhesive properties of laminated woods composed of softwood and hardwood (in Japanese). Mokuzai Gakkaishi 42:140–148

    CAS  Google Scholar 

  3. Shima S, Kimura M (2004) Water based polymer-isocyanate adhesives for wood (in Japanese). Mokuzai Kogyo 48:539–544

    CAS  Google Scholar 

  4. Hu HJ, Liu H, Zhao JJ, Li J (2006) Investigation of adhesion performance of aqueous polymer latex modified by polymeric methylene diisocyanate. J Adhes 82:93–114

    Article  CAS  Google Scholar 

  5. Japanese Industrial Standards Committee (1985) JIS K 6806. Water based polymer-isocyanate adhesives for wood. Japanese Industrial Standards, Tokyo

    Google Scholar 

  6. Miyazaki J, Nakano T (2002) Effects of wood preservatives on adhesive properties. Part III. Curing of aqueous vinyl polymer solution-isocyanate adhesive with preservatives (in Japanese). Mokuzai Gakkaishi 48:184–190

    CAS  Google Scholar 

  7. Hori N (2006) The chemical structure of water based polymerisocyanate adhesives for wood (in Japanese). Mokuzai Kogyo 61:190–194

    CAS  Google Scholar 

  8. Taki K, Tomita B, Mizumachi H (1983) Studies on aqueous vinyl polymer solution-isocyanate adhesives. Part III. Reaction mechanism of the isocyanate group (in Japanese). Mokuzai Gakkaishi 29:145–152

    CAS  Google Scholar 

  9. Taki K, Yamagishi Y (1984) Application of radio frequency heating to wood bonding with aqueous vinyl polymer solution-isocyanate adhesives. Bond quality of four API adhesives (in Japanese). Mokuzai Gakkaishi 30:727–734

    CAS  Google Scholar 

  10. Taki K (1985) Studies on aqueous vinyl polymer solution-isocyanate adhesives. Part IV. Adhesion of woods with isocyanate compounds (in Japanese). Mokuzai Gakkaishi 31:573–578

    CAS  Google Scholar 

  11. Taki K, Yagi S, Yamagishi Y (1980) Bond quality of PVAisocyanate reactive resin adhesives. Part III. Properties of cured resin films (in Japanese). Mokuzai Gakkaishi 26:81–86

    CAS  Google Scholar 

  12. Taki K (1994) The base of aqueous polymer isocyanate (API) adhesives (in Japanese). Proceedings of the 15th Symposium on Wood Adhesion. Research Group on Wood Adhesion, Japan Wood Research Society, pp 1–8

  13. Taki K, Mizumachi H, Yamagishi Y (1978) Bond quality of PVAisocyanate reactive resin adhesives. Part I. Relation between the cross-linking density and the adhesive strength (in Japanese). Mokuzai Gakkaishi 24:237–242

    CAS  Google Scholar 

  14. Taki K, Tomita B, Mizumachi H (1982) Studies on aqueous vinyl polymer solution-isocyanate adhesives. Part I. Mechanical properties of base polymers and bond strength over a wide temperature range (in Japanese). Mokuzai Gakkaishi 28:143–149

    CAS  Google Scholar 

  15. Taki K, Tomita B, Mizumachi H (1982) Studies on aqueous vinyl polymer solution-isocyanate adhesives. Part II. Dependence of mechanical properties and bond strength on the concentration of crosslinks in cured adhesives over a wide temperature range (in Japanese). Mokuzai Gakkaishi 28:150–155

    CAS  Google Scholar 

  16. Umemura K, Takahashi A, Kawai S (1998) Durability of isocyanate resin adhesives for wood. Part I. Thermal properties of isocyanate resin cured with water. J Wood Sci 44:204–210

    Article  CAS  Google Scholar 

  17. Chattopadhyay DK, Sreedhar B, Raju KVSN (2006) The phase mixing studies on moisture cured polyurethane-ureas during cure. Polymer 47:3814–3825

    Article  CAS  Google Scholar 

  18. Follensbee RA, Koutsky JA, Christiansen AW, Myers GE, Geimer RL (1993) Development of dynamic mechanical methods to characterize the cure state of phenolic resole resins. J Appl Polym Sci 47:1481–1496

    Article  CAS  Google Scholar 

  19. Prime RB (1997) Thermosets. In: Turi EA (ed) Thermal characterization of polymeric materials. Academic, London, pp 1381–1387

    Google Scholar 

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Authors and Affiliations

  1. Department of Biomaterial Sciences, Graduate School of Agricultural and Life Sciences, The University of Tokyo, 1-1-1 Yayoi, Bunkyo-ku, Tokyo, 113-8657, Japan

    Nan Ling, Naruhito Hori & Akio Takemura

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  1. Nan Ling
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  2. Naruhito Hori
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  3. Akio Takemura
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Correspondence to Akio Takemura.

Additional information

Part of this article was presented at the 55th Annual Meeting of the Japan Wood Research Society, Kyoto, March 2005

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Ling, N., Hori, N. & Takemura, A. Effect of postcure conditions on the dynamic mechanical behavior of water-based polymer-isocyanate adhesive for wood. J Wood Sci 54, 377–382 (2008). https://doi.org/10.1007/s10086-008-0966-4

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  • DOI: https://doi.org/10.1007/s10086-008-0966-4

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