Utilization of sweet sorghum bagasse and citric acid for manufacturing of particleboard II: influences of pressing temperature and time on particleboard properties

Journal of Wood Science

Official Journal of the Japan Wood Research Society

Table 1 MOR, MOE, screw holding (SH), IB, TS, and formaldeyde emission of sweet sorghum bagasse particleboard bonded with citric acid, PF, and pMDI

Particleboard Type	MOR (MPa)		MOE (GPa)		IB (MPa)	TS (%)	SH (N)	Formaldehyde emission (mg/L)
Particleboard Type	Dry test	Wet test	Dry test	Wet test
CA	21.8 (0.39)	7.7 (0.39)	5.2 (0.19)	1.8 (0.10)	0.89 (0.01)	10.1 (2.89)	348 (10.96)	0.00 (0.0000)
PF	32.9 (1.38)	14.6 (1.19)	4.5 (0.13)	1.4 (0.00)	0.78 (0.03)	20.6 (2.89)	652 (37.16)	0.01 (0.0004)
pMDI	34.1 (1.80)	11.3 (0.34)	4.6 (0.06)	1.6 (0.10)	1.33 (0.09)	23.1 (1.65)	858 (54.78)	0.00 (0.0000)

Values in parentheses are standard deviation
Citric acid (CA) is particleboard bonded with 20 wt% citric acid content in optimum of pressing temperature (200 °C) and time (10 min); phenol formaldehyde (PF) is particleboard bonded with 12 wt% PF resin with the pressing condition of 200 °C for 6 min; polymeric 4,4′-methylenediphenyl isocyanate (pMDI) is particleboard bonded with 8 wt% pMDI with the pressing condition of 180 °C for 8 min; modulus of rupture (MOR) and modulus of elasticity (MOE) are bending properties of particleboard; internal bond (IB) is internal bonding strength of particleboard; thickness swelling (TS) is swelling of thickness of particleboard after imersion of sample in the 20 °C of water for 24 h; screw holding (SH) is screw-holding power of particleboard