Material |
h
(mm) |
λ
(W/(mK))a |
ρ
(g/cm3)b |
Ra
(µm)c | Condition |
|---|
Hinoki | 20 (+ JCP 25) | 0.133 | 0.52 | 54.74 | Brushing |
Marble | 20 (+ JCP 25) | 0.186 | 1.87 | 0.08 | Buffing |
- h thickness of material, λ thermal conductivity, ρ density of material, Ra arithmetic average roughness, JCP Japanese cedar plywood
- aA heat flow meter (HFM 436 Lambda; NETZSCH, Selb, Germany), tuned according to ASTM C518-10 [19] and ISO8310 [20], was used. The direction of heat flow was vertically downward. The temperatures of the high- and low-temperature heat plates were 35 and 15 °C, respectively. The thermal conductivity at an average material temperature of 25 °C was calculated. The test specimens were used with the cedar plywood attached
- bThe samples were cured under the same environmental conditions as used in the thermal conductivity measurement; the mass was measured, and the density calculated. The samples with the cedar plywood adhered were used
- cA contact surface roughness profilometer (SE3500; Kosaka Laboratory Ltd., Tokyo, Japan) with a diamond needle was used. The evaluation length was 50 mm. The central portion of the samples was measured five times with 50-mm spacing, and the average value was calculated
