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Journal of Wood Science

Official Journal of the Japan Wood Research Society

Table 1 Wood and wood-based panels for thermal conductivity measurement

From: Fuel and material utilization of a waste shiitake (Lentinula edodes) mushroom bed derived from hardwood chips II thermal conductivity of compression-dried waste mushroom beds

Wood

n2

Wood-based panels

tree species

Mean air-dry density1

(kg/m3)

Type

Mean air-dry density

(kg/m3)

n

Balsa

129

2

IFB3

2694, 2515, 2446, 3547

64, 5, 6, 27

Kiri

251

2

plywood

4388, 6189

28, 9

Sugi

347

5

MDF

622

2

Douglas fir

447

9

OSB

705

2

Yellow cedar

536

2

PB

811

2

  1. 1Moisture content: 10–12%
  2. 2The number of specimens
  3. 3Insulation fiberboard
  4. 4 T-Class IFB: 12 mm high
  5. 5 T-Class IFB: 15 mm high
  6. 6 T-Class IFB: 20 mm high
  7. 7Sheathing IFB
  8. 8Lauan plywood
  9. 9Softwood plywood
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