Official Journal of the Japan Wood Research Society
From: Effect of thermal modification on the stress relaxation behavior and microstructure of the cell wall
Thermal modification condition | Control | 220 °C | 237.5 °C |
---|---|---|---|
Crystal size D (nm) | |||
Average | 3.03 | 3.30 | 3.17 |
Max. | 3.06 | 3.32 | 3.19 |
Min. | 2.97 | 3.28 | 3.15 |
Crystallinity Cr (%) | |||
Average | 40.7 | 42.1 | 33.1 |
Max. | 41.1 | 42.6 | 35.4 |
Min. | 40.1 | 41.6 | 29.0 |